J. Robins
About
VUO-IC is Finland’s EuroCDP Design Enablement Team. We help users deliver real chips – from architecture and implementation to prototypes and first silicon learning – through a service model that combines university-scale SoC capability, industrial design execution, and national prototyping access.
We are strong at
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Bulk CMOS excellence: RF + analog + digital, with real project execution support—not just advice.
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More-than-Moore capability: RF/mmWave, cryo-CMOS, photonics, and quantum circuit design—including access to the right prototyping environments.
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End-to-end execution readiness: from architecture and design flow setup all the way to MPW planning, packaging, test, and bring-up.
What we offer to you
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Fast intake + partner matching (days, not months)
We triage your need (node, domain, maturity, constraints) and match you with the right experts for execution. -
Secure EDA environment + flow setup
Practical help to configure your project environment: EDA tool selection, PDK/IP routing, sign-off readiness (DRC/LVS), and reusable flow templates. -
Hands-on design enablement
Architecture co-design, RTL & analog/RF IP integration, verification/CI pipelines, and design reviews—covering digital SoC, mixed-signal, RF/mmWave, photonics, and quantum. -
MPW / pilot line interface + tape-out readiness
Shuttle planning, checklist-driven tape-out reviews, and alignment to foundry/pilot requirements so you avoid the “almost ready” trap. -
Packaging, test planning, and prototype bring-up support OSAT coordination, packaging strategy, test board and bring-up planning—so your silicon comes back usable, not just delivered.
Consortium
Finland-based, execution-driven consortium includes VLSI Solution, CoreHW, VTT, Tampere University, and is coordinated by Chip Fusion (Tamlink).
Tampere University provides a production-grade design environment and workflows built for large SoCs, together with the SoC templates, reusable building blocks, and low-level software know-how needed to avoid starting from scratch.
VLSI Solution contributes full-stack ASIC delivery experience from design to production, proven through long commercial track record and high-volume shipments.
VTT adds advanced RTO capability in RF/mmWave, photonics and quantum / cryo-CMOS, and acts as a key interface to prototyping infrastructure.
Chip Fusion coordinates intake & delivery and connects VUO-IC to Finland’s broader semiconductor ecosystem through its leadership role in FiCCC, ensuring users can access the right experts, facilities and routes without navigating the ecosystem alone.
